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Journal of Adhesion Science and Technology

Editorial Board

Editorial Advisory Board:
F. Arefi-Khonsari Paris, France,J.C. Berg Seattle, WA, USA,D. Bhattacharyya Auckland, New Zealand,A.K. Bhowmick Kharagpur, India,L.P. Buchwalter Yorktown Heights, NY, USA,H.J. Busscher Groningen, The Netherlands,M.K. Chaudhury Bethlehem, PA, USA,W.-J. Chen Taipei, Taiwan,E. Chibowski Lublin, Poland,A.D. Crocombe Surrey, UK,G.D. Davis Columbia, MD, USA,C. Della Volpe Trento, Italy,K.L. DeVries Salt Lake City, UT, USA,J. Drelich Houghton, MI, USA,L.T. Drzal E.Lansing, MI, USA,F.M. Etzler Ridgefield, CT, USA,F. Faupel Kiel, Germany,J. Friedrich Berlin, Germany,F. Galembeck Campinas, Brazil,D.G. Gardner Orono, ME, USA,W.W. Gerberich Minneapolis, MN, USA,W. (Voytek) S. Gutowski Highett, Vic., Australia,E.T. Kang Singapore,K. Kendall Birmingham, UK,V. Kovacevic Zagreb, Croatia,D.G. Lee Taejon, Korea,B. Love Blacksburg, VA, USA,A. Marmur Haifa, Israel,J.M. Martín-Martínez Alicante, Spain,H.J. Mathieu Lausanne, Switzerland,J.G. Matisons Mawson Lakes, Australia,M. Nardin Mulhouse, France,A.N. Netravali Ithaca, NY, USA,M. Ochi Osaka, Japan,C.E. Park Pohang, Korea,J.J. Pireaux Namur, Belgium,A. Pizzi Epinal, France,A.V. Pocius St. Paul, MN, USA,L.M. Pritykin Dnepropetrovsk, Ukraine,D.S. Rimai Rochester, NY, USA,A.A. Roche Villeurbanne, France,M. Salkauskas Vilnius, Lithuania,E. Sancaktar Akron, OH, USA,T. Sawa Yamanashi, Japan,F. Simon Dresden, Germany,J.K. Spelt Toronto, Canada,M. Tagawa Isikawa, Japan,F. Tiberg Stockholm, Sweden,W.J. van Ooij Cincinnati, OH, USA,A.C.-Y. Wong Hong Kong, SAR,C.P. Wong Atlanta, GA, USA,Gi Xue Nanjing, P.R. China

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VSPPostal address: P.O. Box 9000, 2300 PA Leiden, The Netherlands
Office address: Plantijnstraat 2, 2321 JC Leiden, The Netherlands
Tel: +31 71 535 3500, Fax: +31 71 531 7532
E-mail: vsppub@brill.nl

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