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Adhesion Aspects of Thin Films, Volume 1

Editor: K.L. Mittal

This book chronicles the proceedings of the First InternationalSymposium on Adhesion Aspects of Thin Films, held in Newark, NewJersey, October 28-29, 1999. Films and coatings are used for a varietyof purposes -- decorative, protective, functional, etc. -- in a host ofapplications. Irrespective of the intended function or application of afilm or a coating, their adequate adhesion to the underlying substratesis of cardinal importance. Concomitantly, the need to understand thefactors controlling adhesion and to tailor adhesion to a desired levelis quite patent.

This book contains a total of 16 papers, which were presented byresearchers from academia, industry and other laboratories, and havebeen rigorously peer reviewed, suitably revised and properly editedbefore inclusion. The topics covered include: mechanisms, origin,evolution and measurement of stresses in thin films; surface stresseffects on the intrinsic stress; various factors affecting stresses inthin films; delamination of coatings caused by residual stress; effectsof surface treatments on the adhesion of metallic films; adhesion of CVDdiamond to carbide cutting inserts; effect of carbon contaminant onadhesion of aluminium films; effect of interlayers on adhesion ofceramic coatings; effect of residual stress on adhesion and wearresistance of hard coatings; tribological properties of ceramic films;oxide layers as barrier coatings on a plastic substrate; adhesionaspects of organic coatings to metals; and adhesion of thin plasmapolymerised fluorocarbon films.

This book, providing a commentary on the current state of knowledge ofadhesion of thin films, will be useful to anyone interested in thinfilms and will provide ideas on how to improve or tailor adhesion of afilm or a coating for a given situation.

2001; viii+270 pages
ISBN 90-6764-338-6
Price (all prices are subject to change without notice): EUR 98/US$ 140

Contents

Click here for information on the SecondInternational Symposium on Adhesion Aspects of ThinFilms, to be held November 5--7,2001


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